英國牛津手持式面銅測厚儀CMI165 返回列表頁

英國牛津手持式面銅測厚儀CMI165產(chǎn)品特色： 

—— 可測試高溫的PCB銅箔 

—— 顯示單位可為mils，μm或oz 

—— 可用于銅箔的來料檢驗 

—— 可用于蝕刻或整平后的銅厚定量測試 

—— 可用于電鍍銅后的面銅厚度測試 

—— 配有SRP—T1，帶有溫度補償功能的面銅測試頭 

—— 可用于蝕刻后線路上的面銅厚度測試

英國牛津手持式面銅測厚儀CMI165

The CMI165 provides unique temperature compensated Copper thickness measurements in an ergonomic hand-held device.
Measurements on Copper are affected by the temperature of the sample. The CMI 165 accounts for temperature in the measurement of thickness ensuring accurate in-process inspection results regardless of Copper temperature.  This versatile, portable gauge equipped with protective case, has a rugged and durable design that allows it to be taken into the harshest environments.

英國牛津手持式面銅測厚儀CMI165
深圳市鼎極天電子有限公司主營產(chǎn)品：膜厚儀,鍍層測厚儀,膜厚測試儀,X射線測厚儀,鍍層厚度檢測儀,X熒光測厚儀